By John Lau, Cheng Lee, C. Premachandran, Yu Aibin
A complete consultant to 3D MEMS packaging equipment and strategies Written via specialists within the box, complex MEMS Packaging serves as a invaluable reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor offers state of the art MEMS (microelectromechanical platforms) packaging suggestions, equivalent to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, inventive, high-performance, strong, and cost effective packaging options for MEMS units. The e-book also will relief in stimulating additional study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the issues explored: complex IC and MEMS packaging developments MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding ideas Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
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Additional info for Advanced MEMS Packaging (Electronic Engineering)
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