Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

A complete consultant to 3D MEMS packaging equipment and strategies Written via specialists within the box, complex MEMS Packaging serves as a invaluable reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative advisor offers state of the art MEMS (microelectromechanical platforms) packaging suggestions, equivalent to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, inventive, high-performance, strong, and cost effective packaging options for MEMS units. The e-book also will relief in stimulating additional study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the issues explored: complex IC and MEMS packaging developments MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding ideas Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Chanhassen, MN), “Methods and apparatus for particle reduction in MEMS devices,” January 17, 2006. Mates, John W. (Portland, OR), “Integrated circuit-based compound eye image sensor using a light pipe bundle,” January 17, 2006. Mostafazadeh, Shahram (San Jose, CA), Smith, Joseph O. (Morgan Hill, CA), Penry, Matthew D. (Morgan Hill, CA), “Flip chip optical semiconductor on a PCB,” January 10, 2006. Fan, Chun Ho (Sham Tseng, HK), Labeeb, Sadak Thamby (Tsuen Wan, HK), Chow, Lap Keung (Kowloon, HK), “Sensor semiconductor package and method of manufacturing the same,” January 3, 2006.

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Palo Alto, CA), “Structures and methods for aligning fibers,” February 4, 2003. Furuyama, Hideto (Kanagawa-ken, JP), “Optical wiring device,” February 4, 2003. Henshall, Gordon D (Harlow, GB), Rolt, Stephen (Herts, GB), “Packaging atmosphere and method of packaging a MEMS device,” November 19, 2002. Bhat, Jerome Chandra (San Francisco, CA), Ludowise, Michael Joseph (San Jose, CA), Steigerwald, Daniel Alexander (Cupertino, CA), “Semiconductor LED flip-chip having low refractive index underfill,” September 24, 2002.

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